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领先的电子元器件分销商 - 邦晶科技 | BonChip-SIM6050 系列SIM卡连接器 产品

GCT

SIM6050 系列SIM卡连接器 产品

GCT 的 SIM 卡连接器为移动、物联网和工业应用中的身份存储提供安全可靠的连接。该连接器提供 Mini (2FF)、Micro (3FF) 和 Nano (4FF) 三种规格,兼具紧凑的尺寸和久经考验的可靠性,能够满足现代通信设备的需求。GCT 的 SIM 卡连接器采用卡片检测开关和耐用的触点系统,确保长期稳定运行。

SIM6050   系列SIM卡连接器 产品

详细资讯

 

Material

Housing Material: LCP 30% GF, UL94V-0, black
Contact Terminal: Phosphor Bronze C5191R-EH, Thickness = 0.15mm, Phosphor Bronze C5210R-EH, Thickness = 0.15mm

Plating

Contact Terminal
Underplating: Ni overall 50µ"
Contact Plating: 3µ" Gold
Solder Area: 1µ" Gold
Metallic Shell
Underplating: Ni overall 50µ"
Solder Area: 1µ" Gold

Electrical

Voltage Rating: 30V
Current Rating: 0.5 A Max
Contact Resistance: 100mΩ max
Insulation resistance: Apply 500VDC 100MΩ min
Dielectric withstanding voltage: 200V AC min for 1 minute

Mechanical

Durability: 5,000 cycles
Mating Force: 0.4kgf Max.
Unmating Force: 0.5kgf Min.

Environmental and Processing

Operating Temperature: -40°C to +85°C
Solder Temperature: 230°C for 30-60 sec, 260°C for 10 sec