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领先的电子元器件分销商 - 邦晶科技 | BonChip-SIM8066 系列SIM卡连接器产品

GCT

SIM8066 系列SIM卡连接器产品

GCT 的 SIM 卡连接器为移动、物联网和工业应用中的身份存储提供安全可靠的连接。该连接器提供 Mini (2FF)、Micro (3FF) 和 Nano (4FF) 三种规格,兼具紧凑的尺寸和久经考验的可靠性,能够满足现代通信设备的需求。GCT 的 SIM 卡连接器采用卡片检测开关和耐用的触点系统,确保长期稳定运行。

SIM8066   系列SIM卡连接器产品

详细资讯

 

Material

Contact Material: Copper Alloy
Standard Insulator Material: High Temperature Thermoplastic
Housing Material: High-Temp Plastic (UL94V-0), Black
Contact Terminal: Copper Alloy
Metallic Shell: Stainless Steel
Cover Shell: Stainless Steel

Plating

Underplating: Nickel
Contact Plating: Gold Flash over Nickel
Solder Tail: Gold Flash over Nickel
Metallic Shell: Solder area gold flash over nickel

Electrical

Voltage Rating: 30V AC/DC
Current Rating: 1.0A AC/DC Max
Contact Resistance: 100mΩ Max
Insulation resistance: 1000MΩ Min at 500V DC for 1 minute between adjacent terminals
Dielectric withstanding voltage: 500V AC for 1 minute

Mechanical

Durability: 5,000 cycles

Environmental and Processing

Operating Temperature: -40°C to +85°C
Solder Temperature: Peak temp 255°C (+5°/-0°C) Maximum (5 seconds)